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cld-ds16 rev 7 product family data sheet cree ? xlamp ? MC-E led www. cree.com/xlamp copyright ? 2008-2011 cree, inc. a ll rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. product description the xlamp m c-e le d is a family of lighting-class, multi-chip l eds that provides high lumen output in a small package. compared to discrete l e ds, xlamp m c-e leds reduce the distance between l ed die, creating a small optical source for excellent optical control and ef - fcient color mixing. xlamp MC-E le ds can reduce le d system com- plexity by reducing the number of components required. cree xlamp l e ds bring high perfor - mance and quality of light to a wide range of lighting applications, in - cluding color-changing lighting, por - table and personal lighting, outdoor lighting, indoor directional lighting, and entertainment lighting. features ? a vailable in white (2600 k C 10,000 k cct), easywhite?, dynamic white, or color (rgbw) ? a nsi-compatible neutral & warm white chromaticity bins ? individually addressable leds ? m c-e dynamic white leds have two cool-white (6,500 k) and two warm-white (2,700 k) led die ? m c-e easywhite le ds avail- able in 2 and 4-step bins, up to 85 cri ? m aximum drive current: 700 ma per led die ? refow solderable C jedec j-std-020 ? e lectrically neutral thermal path ? rohs and r each-compliant cree, inc. 4600 silicon drive durham, nc 27703 us a tel: +1.919.313.5300 table of contents flux characteristics .................... 2 flux characteristics, easywhite ... 3 characteristics - complete p ackage ................. 4 characteristics - p er led die (white) ............... 4 characteristics - p er led die (color) ................ 5 relative spectral p ower distribution - white .................................... 5 relative spectral p ower distribution - color ..................................... 5 relative flux output vs junction temperature ............................. 6 e lectrical characteristics ............. 7 relative intensity vs. current ...... 7 typical spatial radiation p attern .. 8 refow soldering characteristics .. 9 notes ...................................... 10 mechanical dimensions .............. 11 tape and reel .......................... 12 dry p ackaging and p ackaging ..... 13 MC-E white MC-E color MC-E dynamic white
2 flux characteristics, white, dynamic white, color (t j = 25c) the following tables provide several base order codes for xlamp m c-e . it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xlamp m c-e binning and labeling document. part color cct / dominant wavelength range base order codes min luminous flux (lm) @ 350 ma* order code min. max. group flux (lm) white cool white 5,000 k 10,000 k k 370 mce4w t- a2-0000-000k01 m 430 mce4w t- a2-0000-000m01 neutral white 3,700 k 5,000 k j 320 mce4wt-a2-0000-000je4 k 370 mce4w t- a2-0000-000ke4 w arm white 2,600 k 3,700 k g 240 mce4w t- a2-0000-000ge7 h 280 mce4w t- a2-0000-000he7 j 320 mce4wt-a2-0000-000je7 dynamic white 2 cool-white die 6,500 k k 100 mced w t- a1-0000-0000a1001 2 warm-white die 2,700 k g 70 2 cool-white die 6,000 k k 100 mced w t- a1-0000-0000a1002 2 warm-white die 2,700 k g 70 color red 620 nm 630 nm a5 30.6 mce 4ct- a2-0000-00a5aaaa1 green 520 nm 535 nm 67.2 blue 450 nm 465 nm 8.2 cool white 5,700 k 7,000 k 100 red 620 nm 630 nm a4 30.6 mce 4ct- a2-0000-00a4aaab1 green 520 nm 535 nm 67.2 blue 450 nm 465 nm 8.2 neutral white 3,700 k 4,300 k 80 notes: ? cree maintains a tolerance of 7% on fux and power measurements and 2 on cri measurements. ? typical cri for cool white and neutral white (3,700 k - 10,000 k cct) is 75. ? typical cri for warm white (2,600 k - 3,700 k cct) is 80. ? flux and chromaticity are measured with each led die connected to independent drive circuits at 350 ma. the fux and chromaticity of xlamp MC-E white are measured with all leds lit simultaneously. the fux and color of each led in xlamp m c-e dynamic white and m c-e color are measured individually. copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
3 flux characteristics, easywhite MC-E leds (t j = 25c) the following table provides order codes for xlamp m c-e easyw hite le ds. for a complete description of the order-code nomenclature, please consult the xlamp m c-e binning and labeling document. color cct range base order codes min luminous flux @ 350 ma, 25 c 2-step order code 4-step order code group flux (lm) chromaticity region chromaticity region standard cri easywhite 4000 k k 370 40h mceezw - a1-0000-0000k040h 40f mceezw - a1-0000-0000k040f j 320 mceezw-a1-0000-0000j040h mceezw-a1-0000-0000j040f 3500 k j 320 35h mceezw-a1-0000-0000j035h 35f mceezw-a1-0000-0000j035f h 280 mceezw - a1-0000-0000h035h mceezw - a1-0000-0000h035f 3000 k j 320 30h mceezw-a1-0000-0000j030h 30f mceezw-a1-0000-0000j030f h 280 mceezw - a1-0000-0000h030h mceezw - a1-0000-0000h030f 2700 k j 320 27h mceezw-a1-0000-0000j027h 27f mceezw-a1-0000-0000j027f h 280 mceezw - a1-0000-0000h027h mceezw - a1-0000-0000h027f 80-cri minimum easywhite 4000 k k 370 40h mceezw -h1-0000-0000k040h 40f mceezw -h1-0000-0000k040f j 320 mceezw-h1-0000-0000j040h mceezw-h1-0000-0000j040f 3500 k j 320 35h mceezw-h1-0000-0000j035h 35f mceezw-h1-0000-0000j035f h 280 mceezw -h1-0000-0000h035h mceezw -h1-0000-0000h035f 3000 k j 320 30h mceezw-h1-0000-0000j030h 30f mceezw-h1-0000-0000j030f h 280 mceezw -h1-0000-0000h030h mceezw -h1-0000-0000h030f 2700 k j 320 27h mceezw-h1-0000-0000j027h 27f mceezw-h1-0000-0000j027f h 280 mceezw -h1-0000-0000h027h mceezw -h1-0000-0000h027f 85-cri minimum easywhite 3000 k h 280 30h mceezw -p1-0000-0000h030h 30f mceezw -p1-0000-0000h030f g 240 mceezw -p1-0000-0000g030h mceezw -p1-0000-0000g030f 2700 k h 280 27h mceezw -p1-0000-0000h027h 27f mceezw -p1-0000-0000h027f g 240 mceezw -p1-0000-0000g027h mceezw -p1-0000-0000g027f notes: ? for standard cri parts, the typical cri is 80 for 4000 and 3500 k cct parts and typical cri is 82 for 3000 and 2700 k cct. ? cree maintains a tolerance of 7% on fux and power measurements. ? cree maintains a tolerance of 2 on cri measurements. ? flux and chromaticity are measured with each l e d die connected to independent drive circuits at 350 ma and with all le ds lit simultaneously. copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
4 characteristics - complete package the following table lists the product characteristics for the xlamp m c-e led package. characteristics unit minimum typical maximum thermal resistance, junction to solder point - white c/w 3 thermal resistance, junction to solder point - color c/w 4 viewing angle (fwhm) - white degrees 110 viewing angle (fwhm) - color degrees 115 esd classifcation (hbm per mil-std-883d) class 2 led junction temperature c 150 characteristics - per led die (white, easywhite, dynamic white) the following table lists the product characteristics of each individual l e d die within the xlamp m c-e w hite le d package. characteristics unit minimum typical maximum temperature coeffcient of voltage mv/c -4 dc forward current ma 700 reverse v oltage v 5 forward v oltage (@ 350 ma) v 3.2 3.9 forward v oltage (@ 700 ma) v 3.4 characteristics - per led die (color) the following table lists the product characteristics for each l ed die within the xlamp m c-e color led package. characteristics unit red green blue white temperature coeffcient of voltage mv/c typ. -2 -4 -4 -4 dc forward current ma max. 700 700 700 700 reverse v oltage v max. 5 5 5 5 forward v oltage (@ 350 ma) v typ. 2.1 3.4 3.2 3.2 max. 2.5 3.9 3.9 3.9 forward v oltage (@ 700 ma) v typ. 2.3 3.7 3.5 3.5 copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
5 relative spectral power distribution (i f = 350 ma per led) - white the following graph represents typical spectral output of the xlamp m c-e w hite le d with all four le ds on simultaneously. relative spectral power distribution (i f = 350 ma per led) - color the following graph represents typical spectral output of the xlamp m c-e color le d with all four le ds on simultaneously. relative spectral power distribution (if = 350 ma per led) - white the following graph represents typical spectral output of the xlamp MC-E white led with all four leds on simultaneously. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) 5000k - 10000k cct 3700k - 5000k cct 2600k - 3700k cct relative spectral power distribution (if = 350 ma per led) - color the following graph represents typical spectral output of the xlamp MC-E color led with all four leds on simultaneously. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) rgbw (6000k) rgbw (4000k) copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
6 relative spectral power distribution (i f = 350 ma per led) - color (continued) the following graph represents typical spectral output of the xlamp m c-e color led with each le d on independently. relative flux output vs junction temperature (i f = 350 ma) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. the following graph represents typical spectral output of the xlamp MC-E color led with each led on independently. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) red green blue white (6000k) white (4000k) 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 relative luminous flux junction temperature (oc) white red green blue copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
7 electrical characteristics (t j = 25?c) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. relative intensity vs. current (t j = 25?c) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. relative intensity vs. current (tj = 25oc) the following graph represents typical performance of each led die in the xlamp MC-E led 0 20 40 60 80 100 120 140 160 180 200 0 100 200 300 400 500 600 700 relative luminous flux (%) forward current (ma) white, blue red green 0 100 200 300 400 500 600 700 1.5 2.0 2.5 3.0 3.5 4.0 forward current (ma) forward voltage (v) white, blue red green copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
8 typical spatial radiation pattern the following graph represents typical output of the xlamp m c-e led with all four le ds on simultaneously. 0 20 40 60 80 100 120 - 90 - 60 - 30 0 30 60 90 relative luminous intensity (%) angle (o) white color copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
9 reflow soldering characteristics in testing, cree has found xlamp MC-E leds to be compatible with jedec j-std-020c, using the parameters listed below. as a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline may not apply to all pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder a verage ramp-up rate (ts max to tp) 3c/second max. 3c/second max. p reheat: temperature m in (ts min ) 100c 150c p reheat: temperature m ax (ts max ) 150c 200c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained a bove: temperature (t l ) 183c 217c time maintained a bove: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215c 260c time within 5c of actual p eak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6c/second max. 6c/second max time 25c to p eak temperature 6 minutes max. 8 minutes max. note: a ll temperatures refer to topside of the package, measured on the package body surface. t p t l temperature time t 25?c to peak preheat ts t s t p 25 ramp-down ramp-up critical zone t l to t p ts max ts min copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
10 notes moisture sensitivity xlamp m c-e le ds are shipped in sealed, moisture-barrier bags (m bb) designed for long shelf life. if xlamp m c-e leds are exposed to moist environments after opening the m bb packaging but before soldering, damage to the le d may oc - cur during the soldering operation. the following derating table defnes the maximum exposure time (in days) for an xlamp m c-e le d in the listed humidity and tempera- ture conditions. l e ds with exposure time longer than the time specifed below must be baked according to the baking conditions listed here. baking conditions it is not necessary to bake all xlamp m c-e leds. only the le ds that meet all of the following criteria must be baked: le ds that have been removed from the original mbb packaging le ds that have been exposed to a humid environment longer than listed in the m oisture sensitivity section above le ds that have not been soldered le ds should be baked at 80oc for 24 hours. le ds may be baked on the original reels. remove le ds from m bb packaging before baking. do not bake parts at temperatures higher than 80oc. this baking operation resets the exposure time as defned in the moisture sensitivity section above. storage conditions xlamp m c-e le ds that have been removed from original m bb packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 5oc and no greater than 10% rh. for l e ds stored in these condi- tions, storage time does not add to exposure time as defned in the above moisture sensitivity section. rohs compliance the levels of environmentally sensitive, persistent biologically toxic ( p bt), persistent organic pollutants (pop ), or other - wise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with e u directive 2002/95/ e c on the restriction of the use of certain hazardous substances in electrical and electronic equipment (rohs), as amended through april 21, 2006. vision advisory claim wa rning. do not look at exposed l e d lamps in operation. e ye injury can result. for more information about le ds and eye safety, please refer to the cree l ed e ye safety a pplication note (http://www.cree.com/products/pdf/xlamp_e ye- safety.pdf). temperature maximum percent relative humidity 30% 40% 50% 60% 70% 80% 90% 30oc 9 5 4 3 1 1 1 25oc 12 7 5 4 2 1 1 20oc 17 9 7 6 2 2 1 copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
11 mechanical dimensions all measurements are .1mm unless otherwise indicated. top view bottom view side view 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh top view 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh color d1: red d2: green d3: blue d4: white recommended pcb solder p ad dynamic white d1: cool white d2: w arm white d3: cool white d4: w arm white copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
12 (200 lamps) loaded pockets (13 pockets min.) trailer 160mm (min) of empty pockets sealed with tape (34 empty pockets min.) leader 400mm (min) of empty pockets with at least 100mm sealed by tape start end cathode side anode side (denoted by chamfer) 200.0 a a b 5.5 .1 section a-a scale 2 : 1 16.0 .0 + .3 12.0 .1 1.75 .10 4.0 .1 1.5 .1 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction tape and reel all measurements in mm. copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds
13 dry packaging and packaging cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # desiccant (inside bag) humidity indicator (inside bag) label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag dessicant (inside bag) humidi t y indicator card (inside bag) p atent label label with customer order code, q t y , r eel i d , po # cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # desiccant (inside bag) humidity indicator (inside bag) label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag dessicant (inside bag) humidi t y indicator card (inside bag) p atent label label with customer order code, q t y , r eel i d , po # label with customer order code, qty, reel id, po# label with cree bin code, qty, lot # copyright ? 2008-2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. xlamp MC-E leds

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